2021年4月9日，“中科蓝讯-西安电子科技大学物联网芯片联合实验室”正式挂牌成立，该实验室将依托中科蓝讯和西安电子科技大学的优势资源，立足物联网芯片的发展前沿，聚焦无线互联、万物互联等技术领域，结合中科蓝讯的战略规划，开展中长期深入合作，进行综合协同创新。
栏目
IoT
• New IoT ICs deliver highly precise positioning capabilities and fine ranging for IoT applications such as smart locks and IoT sensors
• UWB IoT modules and development kits are available now through NXP’s partner network
• Introducing TrimensionTM under the new brand name NXP offers one of the broadest UWB portfolios available with tailored sensing solutions for vehicles, smartphones, and IoT devices
栏目
IoT
栏目
IoT
